Heat resistant solder resist ink(For FPC) TAINEX HRS-1-5W White Alkaline development type

Excels in heat-resistance, flexibility,
and high-reflectiveness

This is an ink dedicated for use with flexible substrates due to its superb durability against bending.
  •  Feature Flexibility:No crack was detected after continued heating at 125℃for 1000 hours under the bending state (curvature radius R = 0.3).
  •  Feature High light reflection:Light reflection rate: 70-75%

 Feature Flexibility

Continuously heating the inflected product.
-Inflection: curvature radius R=0.3
-Heating: continuous heating at 125 deg. C

Feature High light reflection

Light reflection rate: 70-75%



-Measure: CM-3600d (by Konica Minolta)
-System: SCI
-Film thickness: 20μm
-Substrate: Cu(FPC ; Pl/Cu=25/18μm)

■Coating film performance

ItemTest methodHRS-1-5W
HardnessJIS K5600-5-4H
AdhesionJIS K5600-5-6Category 0
Bending resistanceJIS K5600-5-1 180°inflectionOK(R=0.3)
Solvent resistanceIsopropyl alcohol, 5Min immersion at room temp.OK
Acetone, 5Min immersion at room temp.OK
Acid resistance10% sulfuric ,30 Min immersion at room temp.OK
Alkaline resistance5% sodium hydrate, 5 Min immersion at room temp.OK
Solder resistanceJIS C6481 260 deg.C for 20 Sec.OK
Gold plating resistanceElectroless nickel gold plating process
PCT121 deg. C for 9 HrOK
Light reflection rateMeasurement by colorimeter (SCI system)
(Measurement range:360~740nm)
Radiation rateMeasurement by heat radiation rate meter
(Range: 3~30μm)
CombustiblenessUL94 standardVTM-0 eq.

■Electronic characteristics

ItemTest methodHRS-1-5W
Insulation resistanceInitial value4.3×1010Ω
Moisture resistance test based on JIS C5016-9-4,followed by insulation resistance value measurement.3.3×1010Ω
Surface resistanseJIS C6481-5-101.0×1012Ω
Volume resistivityJIS C6481-5-91.0×1013Ω・cm
Voltage resistance500V×1Min energization
(Measured film thickness 20μm)
Relative permittivityJIS C6481(1MHz)4.1
Dielectric tangentJIS C6481(1MHz)0.04

*The results above show reference values, not standard values.

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